• 25+ years primary experience in the area of plasma etch process development and plasma diagnostics. 16+ years experience in a cutting-edge technology environment at Micron Technology, Samsung Electronics, Seagate Technology, Western Digital and Lam Research.
• Studied different physical aspects related to plasma processing and developed new processes and process flows to enable printing of small features at sub-lithographic resolution.
• Have process development experience with almost all etch levels and etch tools (Lam Research, Applied Materials, TEL, Anelva, Plasmatherm).
• Developed multilayer resist (MLR) etch processes for MEMS applications.
• Developed processes to make integrated optical elements.

• From the very first wafer until transfer to production, individually managed projects and developed MLR and a-Carbon hard mask etch process on different etch tools (Applied Materials and Lam Research) for most critical etch levels at Micron Technology, Inc.
• Developed critical etch processes for double patterning of cell container (DRAM)
• Proposed the process flow (stack, materials and process sequences) and developed most dry etch processes to make small (sub- 50nm) features at a pitch less than 100nm that enabled earlier development of 50nm NAND FLASH in year of 2004. The result of this project was more than $1 billion in investments by Intel in IM Flash Technologies (IMFT is a joint venture of Micron Technology and Intel). Micron Technology uses this technique for manufacturing of 34nm chip (the highest density monolithic multi-level cell [MLC] NAND flash chip the industry has seen). I am the co-author of few key patents on this method.
• Et cetera [Please see my Resume ]

• Semiconductors Technology;
• Nanotechnology;
• MEMS.

Expertise

• Plasma etch physics and chemistry, plasma diagnostics and dry etch process development for various materials in the area of Semiconductor Technology, Nanotechnology and MEMS;
• Design and specification of hard mask layer for advanced patterning;
• Chamber Matching: procedures including Equipment and Process aspects;
• Statistical Methods: DOE for process development.

• I can review or make proposals, critique designs, or put together plans and strategies for meeting your goals.

Contractor

• I can design and implement solutions, from requirements to manufacturing processes.
• Process Development: Plasma etch (RIE, ICP, ECR ) and related semiconductor or MEMS manufacturing processes.

Survice includes on-site visits, telephone conversations, and e-mail or written correspondence. I can provide fresh perspective. My expertise can supplement or complement in-house expertise. I can provide alternative or new ways of resolving of problems. I can be on-call to provide answers, advice, alternatives, or other assistance as needed by development/production teams.